surface mount chip leds technical data hsmb-c190/c170/ c110/c150/c191 features ? small size ? industry standard footprint ? compatible with ir solder ? diffused optics ? operating temperature range of -30 c to +85 c ? right angle package available ? sic blue color ? available in 8 mm tape on 7" (178 mm) diameter reels applications ? keypad backlighting ? push-button backlighting ? lcd backlighting ? symbol backlighting ? front panel indicator description these blue chip leds are designed in an industry standard package for ease of handling and use. blue color chip led is a new product that offers color differentiation for backlighting applications. the hsmb-c150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. the HSMB-C170 has the widely used 2.0 x 1.25 mm footprint. the hsmb-c190 and hsmb-c191 have the industry standard 1.6 x 0.8 mm footprint, and their low profiles (0.8 mm for hsmb-c190 and 0.6 mm for hsmb-c191) and wide viewing angles make these leds exceptional for backlighting applications. footprint (mm) sic blue parts per reel 2.00 x 1.25 HSMB-C170 4000 1.60 x 0.80 hsmb-c190/c191 4000 3.20 x 1.00 [1] hsmb-c110 3000 3.20 x 1.60 hsmb-c150 3000 note: 1. right-angle package. the hsmb-c110 is a right-angle package with the universally accepted dimensions of 3.2 x 1.0 x 1.5 mm. this part is ideal for lcd backlighting and sidelighting applications. all packages are compatible with ir reflow solder processes. the small size and wide viewing angle make these leds prime choices for backlighting applications and front panel illumination especially where space is a premium. device selection guide caution: hsmb-c1xx leds are class 1 esd sensitive per mil-std-1686. please observe appropriate precautions during handling and processing. refer to agilent technologies application note an-1142 for additional details.
2 package dimensions hsmb-c190 HSMB-C170 hsmb-c110 hsmb-c150 2.0 (0.079? 0.3 (0.012) 0.4 ?0.15
(0.016 ?0.006) 0.3 (0.012) polarity cathode
mark 0.8 (0.031) 0.4 ?0.15
(0.016 ?0.006) 1.4
(0.055) 0.62 (0.024) led die diffused
epoxy pc board soldering
terminal 1.25 (0.049) cathode line 3.2 (0.126? 0.5 (0.020) 0.9 (0.035) polarity cathode
mark 1.5 (0.059) led die clear
epoxy pc board soldering
terminal 1.0 (0.039) 1.0 (0.039) 2.6 (0.102? 1.6 (0.063? cathode line 1.6
(0.063? 0.3 (0.012) 0.3 ?0.15
(0.012 ?0.006) 0.3 (0.012) polarity cathode
mark 0.8 (0.031) 0.3 ?0.15
(0.012 ?0.006) 1.0
(0.039) 0.4 (0.016) led die diffused epoxy pc board soldering
terminal 0.8 (0.031) cathode line 0.7 (0.028) min. 3.2 (0.126? 0.5 (0.020) 0.50 ?0.2
(0.020 ?0.008) 0.6 (0.024) polarity cathode
mark 1.1 (0.043) 0.50 ?0.2
(0.020 ?0.008) 2.0 (0.079) 0.8 (0.031) led die diffused
epoxy pc board soldering
terminal 1.6 (0.063) cathode line
3 hsmb-c191 notes:
1. all dimensions in millimeters (inches).
2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. absolute maximum ratings at t a =25 c parameter hsmb-c190/c170/c110/c150/c191 units dc forward current [1] 20 ma peak pulsing current [2] 100 ma power dissipation 92 mw reverse voltage (i r = 100 m a) 5 v maximum led junction temperature 95 c operating temperature range -30 to +85 c storage temperature range -40 to +85 c soldering temperature see ir soldering profile (figure 7) notes: 1. derate linearly as shown in figure 4 for temperature above 25 c. 2. pulse condition of 1/10 duty and 0.1 msec. width. 1.6
(0.063? 0.3 (0.012) 0.3 ?0.15
(0.012 ?0.006) 0.3 (0.012) polarity cathode
mark 0.6 (0.023) 0.3 ?0.15
(0.012 ?0.006) 1.0
(0.039) 0.4 (0.016) led die diffused epoxy pc board soldering
terminal 0.8 (0.031) cathode line 0.7 (0.028) min.
4 light intensity (iv) bin limits [1] intensity (mcd) intensity (mcd) bin id min. max. bin id min. max. a 0.11 0.18 n 28.50 45.00 b 0.18 0.29 p 45.00 71.50 c 0.29 0.45 q 71.50 112.50 d 0.45 0.72 r 112.50 180.00 e 0.72 1.10 s 180.00 285.00 f 1.10 1.80 t 285.00 450.00 g 1.80 2.80 u 450.00 715.00 h 2.80 4.50 v 715.00 1125.00 j 4.50 7.20 w 1125.00 1800.00 k 7.20 11.20 x 1800.00 2850.00 l 11.20 18.00 y 2850.00 4500.00 m 18.00 28.50 optical characteristics at t a =25 c luminous peak dominant viewing intensity [1] wavelength wavelength angle 2 q 1/2 part no. color i v (mcd) @ 20 ma l peak (nm) l d (nm) (degrees) [2] min. typ. typ. typ. typ. hsmb- sic blue 1.60 6.0 428 466 170 c190/c170/ c150/c191 hsmb-c110 sic blue 1.60 6.5 428 466 130 notes: 1. the luminous intensity, i v , is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. u 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. electrical characteristics at t a =25 c reverse forward voltage breakdown thermal capacitance c v f (volts) v r (volts) resistance (pf) @ v f = 0 v, part no. @ i f = 20 ma @ i r = 100 m ar q j-p ( c/w) f = 1 mhz typ. max. min. typ. typ. hsmb-c190/c170/c150/c191 3.8 4.6 5 300 67 hsmb-c110 3.8 4.6 5 300 67 note: 1. bin categories are established for classification of products. products may not be available in all categories. please contact your agilent representative for information on currently available bins. note: 1. bin categories are established for class- ification of products. products may not be available in all categories. please contact your agilent representative for information on currently available bins. blue color bins [1] dom. wavelength (nm) bin id min. max. a 460.0 465.0 b 465.0 470.0 c 470.0 475.0 d 475.0 480.0 tolerance: 1 nm ingan green color bins [1] dom. wavelength (nm) bin id min. max. a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0 tolerance: 1 nm v f tolerance: 0.1 v tolerance: 15%
5 figure 1. relative intensity vs. wavelength. figure 3. relative luminous intensity vs. forward current. figure 4. maximum forward current vs. ambient temperature. figure 5. relative intensity vs. angle for hsmb-c110. figure 2. forward current vs. forward voltage. 100 10 1 0.1 3.0 3.2 3.6 3.8 4.0 v f ?forward voltage ?v i f ?forward current ?ma 3.4 0 5 15 25 i f ?forward current ?ma 0 0.4 1.0 1.2 relative luminous intensity
(normalized at 20 ma) 20 0.6 0.2 0.8 10 0 25 0 20 60 80 100 5 i f max. ?maximum forward current ?ma t a ?ambient temperature ?? 40 15 10 20 380 100 0 580 680 20 relative intensity ?% wavelength ?nm 480 60 40 80 relative intensity ?% 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 relative intensity ?% 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80
6 figure 6. relative intensity vs. angle for HSMB-C170, hsmb-c190, hsmb-c150, and hsmb-c191. figure 8. recommended soldering pattern for HSMB-C170. figure 9. recommended soldering pattern for hsmb-c190 and c191. figure 10. recommended soldering pattern for hsmb-c110. figure 7. recommended reflow soldering profile. note: 1. all dimensions in millimeters (inches). 230? max. 10 sec. max. 4?/sec.
max. over 2 min. time temperature 4?/sec. max. 140-160? ??/sec. max. 1.2 (0.047) 1.2
(0.047) 0.9
(0.035) 1.2
(0.047) 0.8 (0.031) 0.8
(0.031) 0.7
(0.028) 0.8
(0.031) relative intensity ?% 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 5.0 (0.200) 1.0 (0.039) 1.5
(0.059) 1.5
(0.059) 2.0
(0.079) 0.9 (0.035) 0.2 (0.008) 0.9 (0.035)
7 figure 13. reel dimensions. note: 1. all dimensions in millimeters (inches). figure 12. reeling orientation. cathode side printed label user feed direction 10.50 ?1.0 (0.413 ?0.039) 59.60 ?1.00
(2.346 ?0.039) 20.20 min.
( 0.795 min.) 6 ps 178.40 ?1.00
(7.024 ?0.039) 3.0 ?0.5
(0.118 ?0.020) 4.0 ?0.5
(0.157 ?0.020) 5.0 ?0.5
(0.197 ?0.020) 13.1 ?0.5
( 0.516 ?0.020) 8.0 ?1.0 (0.315 ?0.039) figure 11. recommended soldering pattern for hsmb-c150. 1.5 (0.059) 1.5
(0.059) 1.5
(0.059) 2.0
(0.079)
convective ir reflow soldering for more information on ir reflow soldering, refer to application note 1060, surface mounting smt led indicator components. storage condition: 5 to 30? c @ 60% rh max. baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week baking recommended condition: 60 +/C 5?c for 20 hours. figure 15. tape leader and trailer dimensions. notes: 1. all dimensions in millimeters (inches). 2. tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. figure 14. tape dimensions. end start there shall be a
minimum of 160 mm
(6.3 inch) of empty
component pockets
sealed with cover
tape. mounted with
components there shall be a
minimum of 160 mm
(6.3 inch) of empty
component pockets
sealed with cover
tape. minimum of
230 mm
(9.05 inch)
may consist
of carrier
and/or
cover tape. 8.00 ?0.30
(0.315 ?0.012) user feed
direction dim. a
(see table 1) 3.50 ?0.05
(0.138 ?0.002) 1.75 (0.069) dim. c
(see table 1) 0.20 ?0.05
(0.008 ?0.002) carrier tape cover tape dim. b
(see table 1) 4.00 (0.157) 2.00 ?0.05
(0.079 ?0.002) 4.00 (0.157) 1.50 (0.059) table 1
dimensions in millimeters (inches) cathode dim. a
?0.10 (?0.004) dim. b
?0.10 (?0.004) part number dim. c
?0.10 (?0.004) hsmx-c170 series 2.40 (0.094) 1.60 (0.063) 1.20 (0.047) hsmx-c190 series 1.80 (0.071) 0.95 (0.037) 0.87 (0.034) hsmx-c110 series 3.40 (0.134) 1.70 (0.067) 1.20 (0.047) hsmx-c191 series 1.80 (0.071) 0.95 (0.037) 0.75 (0.030) hsmx-c150 series 3.75 (0.148) 2.10 (0.083) 1.30 (0.051) hsmx-c110
position in
carrier tape dim. b
(see table 1) dim. a
(see table 1) r 1.0 ?0.05
(0.039 ?0.002) www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (408) 654-8675 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 271 2451 india, australia, new zealand: (+65) 271 2394 japan: (+81 3) 3335-8152(domestic/interna- tional), or 0120-61-1280(domestic only) korea: (+65) 271 2194 malaysia, singapore: (+65) 271 2054 taiwan: (+65) 271 2654 data subject to change. copyright ? 2002 agilent technologies, inc. obsoletes 5988-1975en february 26, 2002 5988-5211en
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